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Hex Crimp (Shield): IEC 60803 (die designation E)
It features a zinc diecast chassis and a steel-element latch-locking device
which is controlled by water pressure delivering water on both sides of the print
Flash Sync Speed up to 1/320 sec
MULTICOMP 812015 Solder Wire, Lead Free, 1mm Diameter, 217°C, 500g LensCoat LCBCHW Hex Crimp (Shield): IEC 60803This is a Solder Wire, Lead Free, 1mm Diameter, 217C, 500g product from MULTICOMP with the model number 812015Product details Weight Metric 500g Flux Type No Clean and Rosin Flux Weight Imperial 1. 102lb Product Range Melting Temperature 217C Solder Alloy 97. 1, 2. 6, 0. 3 Sn, Ag, Cu External Diameter Imperial 0. 039" External Diameter Metric 1mm Other details Brand MULTICOMP Part Number 812015 Quantity Reel of 1 Technical Data Sheet EN Safety Data
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